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IF2005Mz No-Residue
Flux
DESCRIPTION
IF2005Mz
is known as the benchmark in
No Clean / Residue-Free soldering. This Halide Free product is the chemistry of
choice by the leading electronics assembling companies, due to its
high performance and unparalleled track history. This flux together with the correct
machine parameters will totally eliminate the cleaning process
without compromising board cosmetics and soldering results.
IF2005Mz
can be used in foam,
spray and dipping applications. Preheat temperature 230-266° F
measured at topside of the board before entering the wave. Dwell
time in the wave 3 to 4 seconds at solder pot temperatures of
480-500 °F for Sn/Pb and 500-520 °F for lead-free (depending on alloy
selection).
For
more information click
Implementing
No-Residue Technology.
IF2005Mz
is the only No-Clean/Residue
Free chemistry that ever passed Mil-F-14256F and MIL-STD-2000A
Qualifications without cleaning. (Compliance reports; Mil, Bellcore
and IPC are available on request.)
classified as type ORL0 under IPC
ANSI/J-STD-004 |