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No-Residue™ Soldering Flux
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IF2005Mz
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Appearance
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Solids
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Spec. Gravity
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Conditioner
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Clear/Colorless
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1.8%
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.810
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T2005M
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IF2005Mz
is known as the benchmark in No-clean/Residue-Free soldering. This
Halide Free
No-Residue flux is the chemistry of choice by the leading electronics
assembling companies, due to its high performance, track history and
substantial savings associated with implementing this technology.
With this flux and the
correct machine parameters you can totally
eliminate cleaning without compromising on cosmetics and soldering
results. When quality counts you can count on IF2005Mz No-Residue Flux.
IF2005Mz
is the only No-Clean/Residue Free chemistry ever passed MIL-F-14256F
Qualifications and MIL-STD-2000A Compliance without cleaning.
(Compliance
reports MIL, Bellcore and IPC are available upon request.)
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"True reliability does not allow assumptions based on today’s tests
trying to predict the future, it is better based on sound traceable
performance history."
Patrick O. Bruneel
More information on No-Residue
Spec.
Sheet
RoHS
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No-Clean Cored Solder |
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IF14
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IF14
No-Clean cored solder is formulated to provide Fast wetting
with minimal amount of flux residue. Residues can be brushed off with a dry
brush "no solvents or cleaning liquids required".
Its flux core is based on the
highly successful IF2005Mz No-Residue liquid flux technology and is
halide free. |
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IF14
is
available in all standard alloys (Sn63/37-Sn96/4) and diameters (.015,.020,.030,.040,.062).
Complies to MIL-STD-2000A and Bellcore, test reports available on request.
Work instructions on how to use
the IF14
Spec. Sheet Sn63
Spec. Sheet Sn96 RoHS |
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No-Residue™ Solder Paste
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IF-SP316
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IF-SP316
No-Residue™
Solder paste
is designed to
eliminate cleaning without compromising on board cosmetics. The paste has the
same chemical and physical characteristics as the IF2005Mz No-Residue flux and
the IF14 No-Clean Cored solder. |
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The chemistry becomes totally volatile in the dwell time above reflow. The
solderability of the paste is excellent even on OSP copper boards.
Reflow profile
Spec. Sheet
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Low Dross Bar Solder
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Six Sigma
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Sn - 65 As < .0001 Sb <
.0001 Au < .0003
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Fe < .0005 Ni < .0005 Bi < .0008 Al < .0003
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Cu < .0005 Ag < .0003 Zn < .0005 Cd < .0005
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In < .0007 S -- P
-- Pb Balance
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Six Sigma
®
is the purest solder available in the industry. This electrolytic
refined alloy enhances the physics in your wave soldering operation and
eliminates excessive dross experienced with conventional solders.
Spec. Sheet
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When quality counts, you can
count on Interflux USA
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Copyright©
Interflux USA, Inc. All Rights Reserved Last updated:
March 18, 2010.
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